Module comprising antenna and rf element, and base station including same

ABSTRACT

A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation application of prior application Ser.No. 17/063,929, filed on Oct. 6, 2020, which is a continuationapplication of prior application Ser. No. 17/062,990, filed on Oct. 5,2020, which has issued as U.S. Pat. No. 11,050,165 on Jun. 29, 2021,which is a continuation of prior application Ser. No. 16/906,476, filedon Jun. 19, 2020, which has issued as U.S. Pat. No. 10,797,405 on Oct.6, 2020, which is a continuation application, claiming priority under §365(c), of an International application No. PCT/KR2018/016264, filed onDec. 19, 2018, which was based on and claimed the benefit of a Koreanpatent application number 10-2017-0175064, filed on Dec. 19, 2017, inthe Korean Intellectual Property Office, the disclosure of which isincorporated by reference herein in its entirety.

TECHNICAL FIELD

The disclosure relates to a structure of a module that may be mounted ina base station and a mobile device, including an antenna and an RFelement.

BACKGROUND ART

To meet the demand for wireless data traffic having increased sincedeployment of 4th generation (4G) communication systems, efforts havebeen made to develop an improved 5th generation (5G) or pre-5Gcommunication system. Therefore, the 5G or pre-5G communication systemis also called a ‘Beyond 4th generation (4G) Network’ or a ‘Post longterm evolution (LTE) System’. The 5G communication system is consideredto be implemented in higher frequency (mmWave) bands, e.g., 60 GHzbands, so as to accomplish higher data rates. To decrease propagationloss of the radio waves and increase the transmission distance,beamforming, massive multiple-input multiple-output (MIMO), FullDimensional MIMO (FD-MIMO), array antenna, analog beam forming, andlarge-scale antenna techniques are discussed in 5G communicationsystems. In addition, in 5G communication systems, development forsystem network improvement is underway based on advanced small cells,cloud Radio Access Networks (RANs), ultra-dense networks,device-to-device (D2D) communication, wireless backhaul, moving network,cooperative communication, Coordinated Multi-Points (CoMP),reception-end interference cancellation, and the like. In the 5G system,Hybrid frequency shift keying (FSK) and quadrature amplitude modulation(QAM) Modulation (FQAM) and sliding window superposition coding (SWSC)as an advanced coding modulation (ACM), and filter bank multi carrier(FBMC), non-orthogonal multiple access (NOMA), and sparse code multipleaccess (SCMA) as an advanced access technology, have been developed.

In this regard, the Internet, which is a human centered connectivitynetwork where humans generate and consume information, is now evolvinginto the Internet of Things (IoT) where distributed entities, such asthings, exchange and process information without human intervention. TheInternet of Everything (IoE), which is a combination of IoT technologyand Big Data processing technology through connection with a cloudserver, has emerged. As technology elements, such as “sensingtechnology”, “wired/wireless communication and network infrastructure”,“service interface technology”, and “Security technology” have beendemanded for IoT implementation, a sensor network, Machine-to-Machine(M2M) communication, Machine Type Communication (MTC), and so forth,have been recently researched. Such an IoT environment may provideintelligent Internet technology services that create a new value tohuman life by collecting and analyzing data generated among connectedthings. IoT may be applied to a variety of fields including smart home,smart building, smart city, smart car or connected cars, smart grid,health care, smart appliances and advanced medical services, throughconvergence and combination between existing Information Technology (IT)and various industrial applications.

In line with this, various attempts have been made to apply 5Gcommunication systems to IoT networks. For example, technologies such asa sensor network, MTC, and M2M communication may be implemented bybeamforming, MIMO, and array antennas. Application of a cloud RAN as theabove-described Big Data processing technology may also be considered anexample of convergence between the 5G technology and the IoT technology.

DISCLOSURE OF INVENTION Technical Problem

A plurality of antennas and RF elements are mounted in a base stationapplied to the above-described 5G communication system. The antenna andthe RF element may be coupled to a substrate, and a circuit wiring forconnecting to the antenna, the RF element, and other circuit componentsmay be formed inside the substrate.

That is, the number of required substrates varies according to a methodof coupling and configuring the antenna, the RF element, and thesubstrate, and circuit stability of the antenna module may be determinedbased on this.

The disclosure may provide a device capable of miniaturizing an antennamodule by minimizing the use of a substrate while improving circuitstability of an antenna module.

Solution to Problem

According to the disclosure, an antenna module includes a firstsubstrate layer on which at least one substrate is stacked; an antennacoupled to an upper end surface of the first substrate layer; a secondsubstrate layer having an upper end surface coupled to a lower endsurface of the first substrate layer and on which at least one substrateis stacked; and a radio frequency (RF) element coupled to a lower endsurface of the second substrate layer.

The antenna may be a patch antenna.

The antenna module may further include at least one capacitor coupled tothe lower end surface of the second substrate layer.

The antenna module may further include a first cover coupled to thelower end surface of the first substrate layer to enclose the secondsubstrate layer and the RF element.

The first cover may be configured with a shield can, and the first coverand the first substrate layer may be coupled through a shield can clip.

The RF element and the first cover may be coupled through a thermalinterface material (TIM).

The antenna module may further include a radiator coupled to the lowerend surface of the first substrate layer and a lower end surface of thefirst cover to absorb a heat emitted from the first substrate layer andthe first cover.

A grid array may be formed at the lower end surface of the firstsubstrate layer, and the first substrate layer and the second substratelayer may be conducted through the grid array.

The antenna module may further include a second cover enclosing theantenna at the upper end surface of the first substrate layer.

According to various embodiments of the disclosure, there is provided abase station including a package type module, wherein the package typemodule includes a first substrate layer on which at least one substrateis stacked; an antenna coupled to an upper end surface of the firstsubstrate layer; a second substrate layer having an upper end surfacecoupled to a lower end surface of the first substrate layer and on whichat least one substrate is stacked; and a radio frequency (RF) elementcoupled to a lower end surface of the second substrate layer.

The antenna may be a patch antenna.

The base station may further include at least one capacitor coupled tothe lower end surface of the second substrate layer.

The base station may further include a first cover coupled to the lowerend surface of the first substrate layer to enclose the second substratelayer and the RF element.

The first cover may be configured with a shield can, and the first coverand the first substrate layer may be coupled through a shield can clip.

The RF element and the first cover may be coupled through a thermalinterface material (TIM).

The base station may further include a radiator coupled to the lower endsurface of the first substrate layer and a lower end surface of thefirst cover to absorb a heat emitted from the first substrate layer andthe first cover.

A grid array may be formed at the lower end surface of the firstsubstrate layer, and the first substrate layer and the second substratelayer may be conducted through the grid array.

The base station may further include a second cover enclosing theantenna at the upper end surface of the first substrate layer.

Advantageous Effects of Invention

According to an embodiment disclosed in the disclosure, the number ofsubstrates constituting an antenna module can be reduced; thus, anadvantage can arise in terms of price competitiveness andminiaturization of the antenna module.

Further, because an antenna module structure according to the disclosurereduces the probability of progress failure by a force transferred inonly one direction compared to the conventional antenna modulestructure, it can be more advantageous in terms of mass productivity andreliability.

Further, a heat generated in elements constituting the antenna modulecan be effectively emitted to the outside, thereby improving durabilityof the antenna module.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a diagram illustrating an embodiment of a package type modulemounted in a base station.

FIG. 2 is a diagram illustrating a configuration of an antenna moduleaccording to an embodiment of the disclosure.

FIG. 3 is a diagram illustrating an internal configuration of an antennamodule substrate layer according to an embodiment of the disclosure.

FIG. 4 is a diagram illustrating a side surface of an antenna moduleaccording to an embodiment of the disclosure.

FIG. 5A is a side view of a first substrate layer according to anembodiment of the disclosure.

FIG. 5B is a diagram illustrating a state when viewed a first substratelayer from an upper end surface according to an embodiment of thedisclosure.

FIG. 5C is a graph illustrating a parameter s of the first substratelayer according to an embodiment of the disclosure.

FIG. 6A is a side view of a substrate layer in which a first substratelayer and a second substrate layer are coupled according to anembodiment of the disclosure.

FIG. 6B is a diagram illustrating a state when viewed, from an upper endsurface, a substrate layer in which a first substrate layer and a secondsubstrate layer are coupled according to an embodiment of thedisclosure.

FIG. 6C is a graph illustrating a parameter s of a substrate layer inwhich a first substrate layer and a second substrate layer are coupledaccording to an embodiment of the disclosure.

FIG. 7A is a side view of an antenna module in which a first substratelayer, a second substrate layer, and an antenna array are coupledaccording to an embodiment of the disclosure.

FIG. 7B is a graph illustrating a parameter s of an antenna module inwhich a first substrate layer, a second substrate layer, and an antennaarray are coupled according to an embodiment of the disclosure.

FIG. 8 is a side view illustrating an antenna module according to anembodiment of the disclosure.

MODE FOR THE INVENTION

When describing an embodiment in this specification, a description oftechnical contents well known in the art of the disclosure and notdirectly related to the disclosure will be omitted. This is to clearlydescribe the subject matter of the disclosure, without obscuring thesubject matter, by omitting any unnecessary description.

Similarly, in the attached drawings, some components are shown in anexaggerated or schematic form or are omitted. Further, a size of eachcomponent does not entirely reflect an actual size. Like referencenumerals designate like elements in the drawings.

These advantages and features of the disclosure and a method ofaccomplishing them will become more readily apparent from embodiments tobe described in detail together with the accompanying drawings. However,the disclosure is not limited to the following embodiments, and it maybe implemented in different forms, and the present embodiments enablethe complete disclosure of the disclosure and are provided to enablecomplete knowledge of the scope of the disclosure to those skilled inthe art, and the disclosure is defined by the scope of the claims. Likereference numerals designate like elements throughout the specification.

Herein, it may be understood that each block of a flowchart andcombinations of the flowchart may be performed by computer programinstructions. Because these computer program instructions may be mountedin a processor of a universal computer, a special computer, or otherprogrammable data processing equipment, the instructions performedthrough a processor of a computer or other programmable data processingequipment generate a means that performs functions described in ablock(s) of the flowchart. In order to implement a function with aspecific method, because these computer program instructions may bestored at a computer available or computer readable memory that candirect a computer or other programmable data processing equipment,instructions stored at the computer available or computer readablememory may produce a production item including an instruction means thatperforms a function described in a block(s) of the flowchart. Becausecomputer program instructions may be mounted on a computer or otherprogrammable data processing equipment, a series of operation steps areperformed on the computer or other programmable data processingequipment and generate a process executed with the computer, andinstructions that perform the computer or other programmable dataprocessing equipment may provide steps for executing functions describedin a block(s) of the flowchart.

Further, each block may represent a portion of a module, segment, orcode including at least one executable instruction for executing aspecific logical function(s). Further, in several replaceable executionexamples, it should be noted that functions described in blocks may beperformed regardless of order. For example, two consecutively shownblocks may be substantially simultaneously performed or may be sometimesperformed in reverse order according to a corresponding function.

In this case, a term ‘-unit’ used in the present embodiment means asoftware or hardware component such as a field programmable gate array(FPGA) or an application specific integrated circuit (ASIC) and performsany function. However, “-unit” is not limited to software or hardware.The “-unit” may be configured to store at a storage medium that canaddress and be configured to reproduce at least one processor.Therefore, as an example, “-unit” includes, for example, components suchas software components, object-oriented software components, classcomponents, and task components, processes, functions, attributes,procedures, subroutines, segments of a program code, drivers, firmware,microcode, circuit, data, database, data structures, tables, arrays, andvariables. A function provided within components and “-units” may beperformed by coupling the smaller number of components and “-units” orby subdividing the components and “-units” into additional componentsand “-units”. Further, components and “-units” may be implemented toreproduce at least one CPU within a device or a security multimediacard. Further, in an embodiment, ‘-unit’ may include at least oneprocessor.

FIG. 1 is a diagram illustrating an embodiment of a package type modulemounted in a base station.

A base station according to the disclosure may be equipped with apackage type module 100 illustrated in FIG. 1.

Specifically, the base station according to the disclosure may include aplurality of antenna modules 110. As an example, FIG. 1 discloses apackage type module 100 including 64 antenna modules 110.

Further, the antenna module 110 may include a connector that providespower to the antenna module 110 and a DC/DC converter that converts avoltage of the power. Further, the package type module 100 according tothe disclosure may include a field programmable gate array (FPGA).

The FPGA is a semiconductor element including a designable logic elementand a programmable internal line. The designable logic element may beprogrammed by duplicating logic gates such as AND, OR, XOR, and NOT andmore complex decoder functions. Further, the FPGA may further include aflip-flop or a memory.

The antenna module 110 may include a plurality of low dropout (LDO)regulators as illustrated in FIG. 1. The LDO regulator is a regulatorhaving high efficiency when an output voltage is lower than an inputvoltage and the voltage difference between an input voltage and anoutput voltage is small, and may remove noise of the input power.Further, the LDO regulator may perform a function of stabilizing thecircuit by positioning a dominant pole in the circuit because of lowoutput impedance.

FIG. 1 discloses only a form in which 64 antenna modules 110 are mountedin one package type module 100 as an embodiment according to thedisclosure, but the number of antenna modules mounted in one packagetype module 100 may be changed. Therefore, the scope of the disclosureshould not be determined based on the number of antenna modulesdisclosed in FIG. 1.

Further, because a DC/DC FPGA, LDO, etc. constituting the package typemodule 100 in addition to the antenna module 110 may be added or deletedas necessary, the scope of the disclosure should not be limited by theabove configurations.

FIG. 2 is a diagram illustrating a configuration of an antenna moduleaccording to an embodiment of the disclosure.

The antenna module according to the disclosure may include a firstsubstrate layer 200 on which at least one substrate is stacked, anantenna 220 coupled to an upper end surface of the first substratelayer, a second substrate layer 240 having an upper end surface coupledto a lower end surface of the first substrate layer 200 and on which atleast one substrate is stacked, and a radio frequency (RF) element 260coupled to a lower end surface of the second substrate layer 240.

The first substrate layer 200 and the second substrate layer 240 mean asubstrate in which a circuit is formed, and may generally include aprinted circuit board (PCB) and a printed wiring board (PWB). The firstsubstrate layer 200 and the second substrate layer 240 may form acircuit for connecting each circuit component in a surface or the insideof the substrate based on the designed circuit.

The first substrate layer 200 to which the antenna 220 is coupled may bea main board of the antenna module according to the disclosure. Asillustrated in FIG. 1, the antenna 220 and other circuit components(e.g., LDO, DC/DC, etc. may be included therein) may be electricallyconducted through a wiring formed in the first substrate layer 200.

The first substrate layer 200 may be configured by stacking at least onesubstrate, and the first substrate layer 200 according to the disclosuremay configure only a circuit wiring for connecting an antenna and eachcircuit component, and the second substrate layer 240 may configure onlya circuit wiring for connecting the RF element and each circuitcomponent.

Accordingly, according to the disclosure, the number of substratesconfiguring the first substrate layer 200 may be reduced than that inthe prior art, thereby reducing a thickness and a material cost of thefirst substrate layer, and the circuit wiring inside the first substratelayer may be further simplified and thus a loss by internal resistanceof the substrate may be reduced.

A plurality of antennas 220 may be disposed in the first substrate layer200 according to the disclosure. For example, as illustrated in FIG. 1,four antennas 220 may be spaced apart at regular intervals to bedisposed at an upper end surface of the first substrate layer 200.

According to the disclosure, the antenna 220 may be configured as apatch antenna. The patch antenna may be formed through a method offorming a specific metal shape on the circuit board, and according tothe disclosure, by forming a metal shape at an upper end surface of thefirst substrate layer 200, the antenna 220 may be configured.

The second substrate layer 240 is a substrate layer for a circuit wiringbetween the RF element 260 and other circuit components as describedabove. The second substrate layer 240 may also be configured by stackinga plurality of substrates as in the first substrate layer 200. However,because the second substrate layer 240 does not correspond to the mainboard, the number of substrates stacked on the second substrate layer240 may be smaller than that of substrates stacked on the firstsubstrate layer 200.

The upper end surface of the second substrate layer 240 may be coupledto the lower end surface of the first substrate layer 200 in variousways, and FIG. 1 discloses a method of coupling the first substratelayer 200 and the second substrate layer 240 by disposing a sealing ring245 at both side ends of the second substrate layer 240.

In order to electrically connect the antenna 220 or other circuitcomponents and the RF element 260, the first substrate layer 200 and thesecond substrate layer 240 should be electrically conducted. Therefore,in the disclosure, by forming a grid array at the lower end surface ofthe first substrate layer 200, the first substrate layer 200 and thesecond substrate layer 240 may be conducted through the grid array.

The grid array may representatively include a land grid array (LGA) anda ball grid array (BGA). The LGA is a method suitable for modulesrequiring a high-speed processing speed because a lead inductance issmall in a method of disposing chip electrodes in the form of an arrayat the lower end surface of the substrate. However, the BGA is a methodsuitable for modules requiring a large number of pins in a method ofdisposing a solder in an array form at the lower end surface of thesubstrate.

The grid array should not be formed by biasing to only a portion of thelower end surface of the first substrate layer 200. When a heat occursin the antenna module, a force may be applied to the first substratelayer 200 and the second substrate layer 240 through mutual directions.

In this case, when the grid array is not uniformly distributed, the gridarray may be damaged by the force; thus, the electrical connectionrelationship between the first substrate layer 200 and the secondsubstrate layer 240 may be broken.

Therefore, in order to prevent such a loss in advance, the grid arraymay be uniformly formed at a lower end surface of the first substratelayer 200, and FIG. 2 illustrates, for example, a case in which the gridarray is uniformly formed at both ends of a surface in which the firstsubstrate layer 200 and the second substrate layer 240 contact.

A lower end surface of the second substrate layer 240 may include aplurality of capacitors 250, as illustrated in FIG. 1. Through thecapacitor 250, noise generated in an internal circuit of the secondsubstrate layer can be removed and stability of the circuit can besecured.

Because the capacitor 250 is disposed at the substrate layer as in theabove-described antenna 220, the capacitor 250 may be configured as asurface mount device (SMD) type capacitor.

According to the disclosure, as illustrated in FIG. 2, a first cover 280coupled to a lower end surface of the first substrate layer 200 toenclose the second substrate layer 240 and the RF element 260 may befurther included.

The first cover 280 may be configured with a shield can. That is, thefirst cover 280 may shield electromagnetic waves generated in the RFelement 260 and the second substrate layer 240 existing inside the firstcover, and by removing noise generated in a flexible circuit board ofthe second substrate layer 240, the influence in which peripheralcomponents receive from electromagnetic waves may be minimized.

The first cover 280 may be coupled to the lower end surface of the firstsubstrate layer 200 through a shield can clip 285 having the sameelectromagnetic shielding property as that thereof, and the shield canclip may be disposed at both ends in which the first cover 280 and thefirst substrate layer 200 are coupled.

The RF element 260 coupled to the lower end surface of the secondsubstrate layer 240 means a high-frequency chip for wirelesscommunication and may include an RFIC chip in which an RF circuit isimplemented on one semiconductor chip using an active element and apassive element. Accordingly, the RF element may include an amplifier, atransmitter, a receiver, and a synthesizer.

Because the RF element 260 includes a plurality of electrical elements,as described above, a heat may be generated because of an operation ofthe element, and the element may be damaged by heat generation, and asdescribed above, a pressure may be applied to the second substrate layer240.

Therefore, it is necessary to emit a heat generated in the RF element260 to the outside, but the disclosure discloses a method of emitting aheat generated in an RF element to the outside of an antenna module bydisposing a thermal interface material (TIM) 270 between the RF elementand the first cover.

That is, a heat generated in the RF element 260 through the TIM may betransferred to the first cover 280, and the heat transferred to thefirst cover 280 may be transferred to a lower end surface of the firstsubstrate layer 200 and a heat sink 290 coupled to the lower end surfaceof the first cover 280 to be emitted to the outside of the antennamodule.

At an upper end surface of the first substrate layer 200, a second cover210 formed to enclose the antenna 220 may be disposed. The second covermay be disposed in a direction in which the antenna 220 emits a beam, asillustrated in FIG. 2.

Therefore, unlike the first cover (because the first cover is primarilyused for electromagnetic shielding, it may be generally preferable toform the first cover with a metal), it may be preferable to form thesecond cover 210 with a material such as plastic that does not affect abeam emitted through the antenna 220.

FIG. 2 discloses only one embodiment of an antenna module according tothe disclosure, and the scope of the disclosure should not be limited tothe form and configuration illustrated in FIG. 2.

FIG. 3 is a diagram illustrating an internal configuration of an antennamodule substrate layer according to an embodiment of the disclosure.

As described above, the RF element 260 and the antenna 220 may beelectrically connected through the first substrate layer 200 and thesecond substrate layer 240. FIG. 3, for example, illustrates a case inwhich four antennas 220 are disposed at an upper end surface of thefirst substrate layer 200 and in which the first substrate layer 200 andthe second substrate layer 240 are coupled in a BGA manner.

In this case, a signal transmitted through the antenna 220 may betransferred to the RF element 260 by a wiring formed in a pattern shapewithin the first substrate layer 200 and the second substrate layer 240,and a signal generated through the RF element 260 may be radiated to theoutside through the antenna 220.

In the base station including a package type module according to thedisclosure, the package type module may include a first substrate layeron which at least one substrate is stacked, an antenna coupled to anupper end surface of the first substrate layer, a second substrate layerhaving an upper end surface coupled to a lower end surface of the firstsubstrate layer and on which at least one substrate is stacked, and aradio frequency (RF) element coupled to a lower end surface of thesecond substrate layer.

The antenna may be a patch antenna, and the base station may furtherinclude at least one capacitor coupled to the lower end surface of thesecond substrate layer.

Further, the base station may further include a first cover coupled tothe lower end surface of the first substrate layer to enclose the secondsubstrate layer and the RF element, and the first cover may beconfigured with a shield can, and the first cover and the firstsubstrate layer may be coupled through a shield can clip.

The RF element and the first cover may be coupled through a thermalinterface material (TIM), and the base station may further include aradiator coupled to the lower end surface of the first substrate layerand a lower end surface of the first cover to absorb a heat emitted fromthe first substrate layer and the first cover.

A grid array may be formed at the lower end surface of the firstsubstrate layer, and the first substrate layer and the second substratelayer may be conducted through the grid array, and the base station mayfurther include a second cover enclosing the antenna at the upper endsurface of the first substrate layer.

FIG. 4 is a diagram illustrating a side surface of an antenna moduleaccording to an embodiment of the disclosure.

According to one embodiment, the antenna module may include a firstsubstrate layer 410 on which at least one substrate is stacked, a secondsubstrate layer 420 having an upper end surface coupled to a lower endsurface of the first substrate layer 410 and on which at least onesubstrate is stacked, and an RF element coupled to a lower end surfaceof the second substrate layer 420.

According to one embodiment, the first substrate layer 410 may be a mainboard of the antenna module. According to various embodiments, the firstsubstrate layer 410 and the second substrate layer 420 may beelectrically connected through a land grid array (LGA) or a ball gridarray (BGA).

According to an embodiment, the upper end surface of the first substratelayer 410 may include at least one antenna array 440 that enables radiowaves to be emitted to the upper end surface of the first substratelayer 410. According to various embodiments, an electrical signalsupplied from the second substrate layer 420 through the LGA or the BGAmay be supplied to the at least one antenna array 440 through a feedline 450 formed inside the first substrate layer 410.

According to an embodiment, the electrical signal may be an electricalsignal supplied from an RF element 430 in order to emit radio waves of aspecific frequency. According to various embodiments, by supplying anelectrical signal supplied from the RF element 430 to at least oneantenna array 440 through the feed line 450 provided inside the secondsubstrate layer 420 and the first substrate layer 410, the antennamodule may perform beamforming. For example, the at least one antenna440, having received the electrical signal from the RF element 430through the feed line 450 may emit horizontal polarization or verticalpolarization to form a beam in a specific direction.

According to an embodiment, the RF element 430 may be disposed at alower end surface of the second substrate layer 420 to supply anelectrical signal (or RF signal) to the second substrate layer 420.According to various embodiments, the lower end surface of the secondsubstrate layer 420 and the RF element 430 may be electrically connectedthrough soldering.

According to an embodiment, impedance matching of a line formed fortransmission of an electrical signal may be implemented within thesecond substrate layer 420 and the feed line 450 formed inside the firstsubstrate layer 410. According to various embodiments, by implementingimpedance matching of the first substrate layer 410 and the secondsubstrate layer 420 through the BGA, a beam of a specific frequency bandmay be emitted through the antenna array 440.

According to one embodiment, the upper end surface of the antenna array400 may include a spacer 470 including a metallic material, and a topantenna array 460 may be disposed at the upper end surface of the spacer470. According to various embodiments, by disposing apart the antennaarray 400 and the top antenna array 460 by a specific distance throughthe spacer 470, a frequency band of radio waves emitted through theantenna module may be improved. According to an embodiment, the topantenna array 460 may be disposed inside a third substrate layer 480.For example, the third substrate layer 480 may be a flexible printedcircuit board (FPCB).

FIG. 5A is a side view of a first substrate layer according to anembodiment of the disclosure.

According to an embodiment, an RF element 520 may be disposed at a lowerend surface of a first substrate layer 510. According to variousembodiments, the RF element 520 and the first substrate layer 510 may becoupled in a soldering manner.

According to an embodiment, the RF element 520 may supply an RF signalfor emitting radio waves to the first substrate layer 510. According tovarious embodiments, the RF signal supplied to the lower end surface ofthe first substrate layer 510 may be transmitted to an upper end surfaceof the first substrate layer 510 through a wiring inside the firstsubstrate layer 510.

FIG. 5B is a diagram illustrating a state when viewed a first substratelayer from an upper end surface according to an embodiment of thedisclosure.

According to an embodiment, the first substrate layer 510 may receive anRF signal from the RF element through at least one bottom surfacecontact node 530 disposed at a lower end surface thereof. According tovarious embodiments, the RF signal received through the bottom surfacecontact node 530 may be transmitted to at least one top surface contactnode 520 disposed at the upper end surface of the first substrate layer510 through a wiring inside the first substrate layer 510.

According to an embodiment, the bottom surface contact node 530 may beelectrically connected to the RF element through a soldering method.According to various embodiments, the top surface contact node 520 maybe electrically connected to a second substrate layer disposed at theupper end surface of the first substrate layer 510 in a BGA or LGAmethod.

FIG. 5C is a diagram illustrating a parameter s of the first substratelayer according to an embodiment of the disclosure. More specifically,FIG. 5C is a diagram illustrating a parameter s₁₁ of the first substratelayer. According to an embodiment, the parameter s₁₁ may mean areflection loss of the received signal.

According to an embodiment, a reflection loss of a signal in a mmWavefrequency band (frequency band of 23 GHz or more) may be less than −10dB. According to various embodiments, the parameter s of the firstsubstrate layer may be adjusted by adjusting an internal wiring of thefirst substrate layer. For example, a first substrate layer for emittinga beam in a 28 GHz frequency band may be generated through internalwiring adjustment.

FIG. 6A is a side view of a substrate layer in which a first substratelayer and a second substrate layer are coupled according to anembodiment of the disclosure.

According to an embodiment, a BGA 630 or an LGA may be disposed betweenan upper end surface of a first substrate layer 610 and a lower endsurface of a second substrate layer 620. According to variousembodiments, an RF signal supplied from the RF element disposed at thelower end surface of the first substrate layer 610 may flow to the upperend surface of the first substrate layer through an internal wiring ofthe first substrate layer 610 and flow to the lower end surface of thesecond substrate layer 630 through the BGA 630 or the LGA.

According to one embodiment, a feed line 640 for transmitting the RFsignal supplied to the lower end surface of the second substrate layer630 to the upper end surface of the second substrate layer 630 may beformed inside the second substrate layer 630. According to variousembodiments, the RF signal transmitted through the feed line 640 to theupper end surface of the second substrate layer 630 may be supplied toan antenna array disposed at the upper end surface of the secondsubstrate layer 630.

FIG. 6B is a diagram illustrating a state when viewed, from an upper endsurface, a substrate layer in which a first substrate layer and a secondsubstrate layer are coupled according to an embodiment of thedisclosure.

According to an embodiment, the second substrate layer 620 may receivean RF signal from the first substrate layer through at least one bottomsurface contact node 630 disposed at the lower end surface thereof. Forexample, the at least one bottom surface contact node 630 may beconfigured with a BGA 630 or an LGA.

According to one embodiment, the RF signal received through the bottomsurface contact node 630 may be transmitted to at least one top contactnode 650 disposed at the upper end surface of the second substrate layer620 through a feed line inside the second substrate layer 620. Accordingto various embodiments, the RF signal transmitted to the upper endsurface of the second substrate layer 620 through the feed line 640 maybe supplied to an antenna array disposed at the upper end surface of thesecond substrate layer 620.

FIG. 6C is a diagram illustrating a parameter s of a substrate layer inwhich a first substrate layer and a second substrate layer are coupledaccording to an embodiment of the disclosure. More specifically, FIG. 6Cis a diagram illustrating a parameter s₁₁ of a substrate layer in whicha first substrate layer and a second substrate layer are coupled.According to an embodiment, the parameter s₁₁ may mean a reflection lossof the received signal.

According to an embodiment, a reflection loss of a signal in the mmWavefrequency band may be less than −10 dB. According to variousembodiments, the parameter s of the substrate layer to which the firstsubstrate layer and the second substrate layer are coupled may beadjusted by adjusting an internal wiring of the first substrate layerand a feeding line of the second substrate layer.

FIG. 7A is a side view of an antenna module in which a first substratelayer, a second substrate layer, and an antenna array are coupledaccording to an embodiment of the disclosure.

According to an embodiment, a BGA or an LGA may be disposed between anupper end surface of a first substrate layer 710 and a lower end surfaceof a second substrate layer 720. According to various embodiments, an RFsignal supplied from the RF element disposed at a lower end surface ofthe first substrate layer 710 may flow to an upper end surface of thefirst substrate layer 710 through an internal wiring of the firstsubstrate layer 710 and flow to the lower end surface of the secondsubstrate layer 720 through the BGA or the LGA.

According to an embodiment, a feed line for transmitting an RF signalsupplied to the lower end surface of the second substrate layer 720 tothe upper end surface of the second substrate layer 720 may be formedinside the second substrate layer 720. According to various embodiments,the RF signal transmitted to the upper end surface of the secondsubstrate layer 720 through the feed line may be supplied to an antennaarray 740 disposed at the upper end surface of the second substratelayer 720.

According to an embodiment, at the upper end surface of the secondsubstrate layer 720, a plurality of antenna arrays 740 may be disposedto perform beamforming. According to various embodiments, a spacer 730including a metallic material may be disposed at the upper end surfaceof an antenna array 750.

According to an embodiment, a third substrate layer 750 including anauxiliary antenna array may be disposed at an upper end surface of thespacer 730. For example, the third substrate layer 750 may be a flexibleprinted circuit board (FPCB). According to various embodiments, theauxiliary antenna array included in the third substrate layer 750 mayimprove a frequency band of the antenna module.

According to an embodiment, at an upper end surface of the thirdsubstrate layer 750, a case 760 for protecting the antenna array and thesubstrate layer stacked under the upper end surface of the thirdsubstrate layer 750 may be disposed. For example, the case 760 may bemade of plastic. According to various embodiments, the case 760 may be aradome.

FIG. 7B is a graph illustrating a parameter s of an antenna module inwhich a first substrate layer, a second substrate layer, and an antennaarray are coupled according to an embodiment of the disclosure. Morespecifically, FIG. 7B is a diagram illustrating a parameter s₁₁ of asubstrate layer in which a first substrate layer and a second substratelayer are coupled. According to an embodiment, the parameter s₁₁ maymean a reflection loss of the received signal.

According to an embodiment, a reflection loss of the signal in themmWave frequency band may be less than −10 dB. According to variousembodiments, a frequency band of the antenna module having s₁₁ parametercharacteristics illustrated in FIG. 7B may be 26 GHz to 30 GHz.

According to an embodiment, a frequency band of the antenna module maybe determined based on a size of the antenna array constituting theantenna module, a dielectric constant of a dielectric body in which theantenna array is disposed, and a length of a feed line for supplying anRF signal to the antenna array.

FIG. 8 is a side view illustrating an antenna module according to anembodiment of the disclosure.

According to an embodiment, the antenna module may include a substratelayer 810 on which a plurality of substrates are stacked. According tovarious embodiments, the substrate layer 810 may be divided into a firstsubstrate layer constituting an upper end surface thereof and a secondsubstrate layer constituting a lower end surface thereof. For example,the first substrate layer and the second substrate layer may beelectrically connected through a BGA or an LGA.

According to an embodiment, an RF element may be disposed at the lowerend surface of the substrate layer 810. According to variousembodiments, an RF signal supplied through the RF element may besupplied to a first antenna array 820 disposed at the upper end surfaceof the substrate layer 810 through an internal wiring or a feed line ofthe substrate layer 810. For example, the first antenna array 820 mayform a beam of a specific band based on the RF signal received from theRF element.

According to an embodiment, a spacer 830 including a metallic materialmay be disposed at the upper end surface of the first antenna array 820,and a second antenna array 860 may be disposed at the upper end surfaceof the spacer 830. According to various embodiments, a separationdistance between the first antenna array 820 and the second antennaarray 860 may be maintained by the spacer 830. According to anembodiment, the separation distance between the first antenna array 820and the second antenna array 860 may be determined based on a frequencyband of radio waves to be radiated through the antenna module.

According to an embodiment, an adhesive region 840 may be disposed atthe upper end surface of the spacer 830, and a flexible printed circuitboard (FPCB) 850 may be adhered to an upper end surface of the spacer860 by the adhesive region 840. According to various embodiments, theFPCB 850 may include at least one second antenna array 860. According toan embodiment, a frequency band of the antenna module may be improved bythe second antenna array 860 included in the FPCB 850.

The embodiments of the disclosure disclosed in this specification anddrawings only present a specific example in order to easily describe thetechnical contents according to an embodiment of the disclosure and tohelp an understanding of the embodiments of the disclosure, and they donot intend to limit the scope of the embodiments of the disclosure. Thatis, it is apparent to those skilled in the art to which othermodifications based on the technical idea of the disclosure can bepracticed. Further, the respective embodiment may be operated withcombined, as needed. For example, portions of a first embodiment, secondembodiment, and third embodiment of the disclosure may be combined to beoperated in a base station and a terminal. Further, the embodiments aresuggested based on an LTE system, but other modified examples based onthe spirit and scope of the embodiment may be applied to other systemssuch as a 5G or NR system.

What is claimed is:
 1. A module for use in a wireless communicationapparatus for communicating with a terminal, the module comprising: afirst printed circuit board (PCB) comprising multiple layers; aplurality of second PCBs, each of the plurality of second PCBscomprising multiple layers; a plurality of antenna sets disposed on afirst side of the first PCB; and a plurality of radio frequencyintegrated circuit (RFIC) chips, wherein each of the second PCBs isconfigured to electrically connect a corresponding RFIC chip of theplurality of RFIC chips to the first PCB, and wherein each of the secondPCBs is coupled to a second side of the first PCB opposite to the firstside of the first PCB via a grid array.
 2. The module of claim 1,wherein each of the second PCBs is configured to electrically connect acorresponding RFIC chip of the plurality of RFIC chips to acorresponding antenna set of the plurality of antenna sets on the firstPCB.
 3. The module of claim 1, wherein at least one capacitor forremoving noise is mounted at the first side of each of the plurality ofsecond PCBs.
 4. The module of claim 1, wherein each of the second PCBshas a smaller surface area than the first PCB and the second PCBs arespaced apart from each other, wherein the first side of the first PCBincludes a plurality of regions corresponding to the plurality of secondPCBs, wherein each of the antenna sets is disposed on a correspondingregion of the plurality of regions of the first PCB.
 5. The module ofclaim 1, further comprising: a plurality of first covers configured tocover the plurality of radio frequency integrated circuit (RFIC) chips,respectively.
 6. The module of claim 5, further comprising: a thermalinterface material (TIM) disposed between each of the plurality of firstcovers and a corresponding RFIC chip.
 7. The module of claim 5, furthercomprising: a shield can be disposed on each of the plurality of firstcovers.
 8. The module of claim 1, further comprising: a second cover forcovering the plurality of antenna sets.
 9. The module of claim 1,wherein each of grid arrays is spaced apart from an adjacent grid arrayat a predetermined interval in a space between the first PCB and acorresponding second PCB of the second PCBs.
 10. The module of claim 1,wherein a set of antennas within the plurality of antenna sets forms agroup and each of antennas included in the group is spaced apart from anadjacent antenna in the group at a predetermined interval.
 11. Awireless communication apparatus for communicating with a terminal, thewireless communication apparatus comprising: a power supply; a fieldprogrammable gate array (FPGA) having programmable logic circuits; and amodule; wherein the module comprises: a first printed circuit board(PCB) comprising multiple layers; a plurality of second PCBs, each ofthe plurality of second PCBs comprising multiple layers; a plurality ofantenna sets disposed on a first side of the first PCB; and a pluralityof radio frequency integrated circuit (RFIC) chips, wherein each of thesecond PCBs is configured to electrically connect a corresponding RFICchip of the plurality of RFIC chips to the first PCB, and wherein eachof the second PCBs is coupled to a second side of the first PCB oppositeto the first side of the first PCB via a grid array.
 12. The wirelesscommunication apparatus of claim 11, wherein each of the second PCBs isconfigured to electrically connect a corresponding RFIC chip of theplurality of RFIC chips to a corresponding antenna set of the pluralityof antenna sets on the first PCB.
 13. The wireless communicationapparatus of claim 11, wherein at least one capacitor for removing noiseis mounted at the first side of each of the plurality of second PCBs.14. The wireless communication apparatus of claim 11, wherein each ofthe second PCBs has a smaller surface area than the first PCB and thesecond PCBs are spaced apart from each other, wherein the first side ofthe first PCB includes a plurality of regions corresponding to theplurality of second PCBs, wherein each of the antenna sets is disposedon a corresponding region of the plurality of regions of the first PCB.15. The wireless communication apparatus of claim 11, furthercomprising: a plurality of first covers configured to cover theplurality of radio frequency integrated circuit (RFIC) chips,respectively.
 16. The wireless communication apparatus of claim 15,further comprising: a thermal interface material (TIM) disposed betweeneach of the plurality of first covers and a corresponding RFIC chip. 17.The wireless communication apparatus of claim 15, further comprising: ashield can be disposed on each of the plurality of first covers.
 18. Thewireless communication apparatus of claim 11, further comprising: asecond cover for covering the plurality of antenna sets.
 19. Thewireless communication apparatus of claim 11, wherein each of gridarrays is spaced apart from an adjacent grid array at a predeterminedinterval in a space between the first PCB and a corresponding second PCBof the second PCBs.
 20. The wireless communication apparatus of claim11, wherein a set of antennas within the plurality of antenna sets formsa group and each of antennas included in the group is spaced apart froman adjacent antenna in the group at a predetermined interval.